Patent Assignment Details
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| Reel/Frame: | 007234/0315 | |
| Pages: | 3 |
| | Recorded: | 12/08/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/15/1997
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Application #:
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08288781
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Filing Dt:
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08/12/1994
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Title:
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SEMICONDUCTOR DEVICE IN WHICH A FIRST RESIN-ENCAPSULATED PACKAGE IS MOUNTED ON A SECOND RESIN-ENCAPSULATED PACKAGE
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Assignee
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| 72 HORIKAWA-CHO |
| SAIWAI-KU, |
| KAWASAKI-SHI, KANAGAWA-KEN,, JAPAN |
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Correspondence name and address
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MARVIN J. SPIVAK
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OBLON, SPIVAK, MCCLELLAND, ET AL.
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1755 JEFFERSON DAVIS HIGHWAY
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FOURTH FLOOR
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ARLINGTON, VIRGINIA 22202
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