Patent Assignment Details
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Reel/Frame: | 007284/0242 | |
| Pages: | 5 |
| | Recorded: | 12/19/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/27/1996
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Application #:
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08361062
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Filing Dt:
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12/19/1994
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Title:
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THREE DIMENSIONAL DIE PACKAGING IN MULTI-CHIP MODULES
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Assignee
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LAW DEPARTMENT |
1700 S. PATTERSON BLVD. |
DAYTON, OHIO 45479 |
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Correspondence name and address
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JAMES M. STOVER
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LAW DEPARTMENT
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1700 S. PATTERSON BLVD.
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DAYTON, OH 45479
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