Patent Assignment Details
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| Reel/Frame: | 007285/0071 | |
| Pages: | 3 |
| | Recorded: | 12/16/1994 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/1999
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Application #:
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08357634
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Filing Dt:
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12/16/1994
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Title:
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THERMOSETTING SILICONE COMPOSITION
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Assignee
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| MITSUI BUILDING NO. 6, 3-16 |
| 2-CHOME, NIHONBASHI-MUROMACHI |
| CHUO-KU, TOKYO 103, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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SHARON K. SEVERANCE
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PATENT DEPARTMENT MAIL-C01232
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P.O. BOX 0994
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MIDLAND, MI 48686
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