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Patent Assignment Details
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Reel/Frame:007302/0584   Pages: 2
Recorded: 01/10/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/03/1997
Application #:
08370597
Filing Dt:
01/10/1995
Title:
TRANSFER MOLDING PROCESS FOR ENCAPSULATING SEMICONDUCTOR DEVICES
Assignor
1
Exec Dt:
01/09/1995
Assignee
1
100 INDEPENDENCE MALL WEST
PATENT DEPARTEMNT
PHILADELPHIA, PENNSYLVANIA 19106
Correspondence name and address
MICHAEL B. FEIN
ROHM AND HAAS COMPANY
PATENT DEPARTMENT, 7TH FLOOR
INDEPENDENCE MALL WEST
PHILADELPHIA, PA 19106

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