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Patent Assignment Details
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Reel/Frame:007484/0248   Pages: 3
Recorded: 05/01/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/17/1997
Application #:
08431978
Filing Dt:
05/01/1995
Title:
COOLING STRUCTURE FOR INTEGRATED CIRCUIT ELEMENT MODULES, ELECTRONIC DEVICE AND HEAT SINK BLOCK
Assignors
1
Exec Dt:
04/25/1995
2
Exec Dt:
04/25/1995
3
Exec Dt:
04/25/1995
Assignee
1
1015, KAMIKODANAKA, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA, JAPAN 211
Correspondence name and address
ARMSTRONG, WESTERMAN, HATTORI ET AL.
SUITE 1000
1725 K STREET, N.W.
WASHINGTON, DC 20006
ATTN: JAMES P. WELCH

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