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Patent Assignment Details
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Reel/Frame:007668/0980   Pages: 13
Recorded: 09/13/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/03/2002
Application #:
08477054
Filing Dt:
06/07/1995
Title:
THIN FILM WIRING SCHEME UTILIZING INTER-CHIP SITE SURFACE WIRING
Assignors
1
Exec Dt:
05/31/1995
2
Exec Dt:
05/31/1995
3
Exec Dt:
06/07/1995
4
Exec Dt:
05/31/1995
5
Exec Dt:
05/31/1995
6
Exec Dt:
06/01/1995
7
Exec Dt:
06/01/1995
8
Exec Dt:
05/31/1995
9
Exec Dt:
06/01/1995
Assignee
1
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
IBM CORPORATION
IRA DAVID BLECKER
INTELLECTUAL PROPERTY LAW DEPT.
DEPT. 18G/BLDG. 300482, 1580 RTE. 52
HOPEWELL JUNCTION, NY 12533-6531

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