Patent Assignment Details
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| Reel/Frame: | 007680/0906 | |
| Pages: | 3 |
| | Recorded: | 09/18/1995 | | |
| Conveyance: | ASSIGNS A 50% INTEREST TO EACH ASSIGNEE |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08529603
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Filing Dt:
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09/18/1995
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Title:
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METHOD FOR EXAMINATION OF SILICON WAFER SURFACE DEFECTS
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Assignees
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| 735, NIPPA-CHO, KOUHOKU-KU, YOKOHAMA-SHI |
| KANAGAWA-KEN, JAPAN |
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| 72,HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI |
| KANAGAWA-KEN, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK
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ATTN: MATTHEW M. JACOB
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805 15TH STREET, N.W., SUITE 700
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WASHINGTON, D.C. 20005
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