Patent Assignment Details
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| Reel/Frame: | 007704/0968 | |
| Pages: | 4 |
| | Recorded: | 09/22/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/01/1997
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Application #:
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08532281
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Filing Dt:
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09/22/1995
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Title:
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METHOD AND APPARATUS FOR CONTROLLING BONDING LOAD OF FINE LEAD ELECTRODE
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Assignee
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| 72 HORIKAWA-CHO, SAIWAI-KU, KAWASAKI-SHI, |
| JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL
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MR. ERNEST F. CHAPMAN
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1300 I STREET, N.W.
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WASHINGTON, D.C. 20005
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