Patent Assignment Details
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| Reel/Frame: | 007705/0872 | |
| Pages: | 4 |
| | Recorded: | 09/29/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/1998
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Application #:
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08536141
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Filing Dt:
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09/29/1995
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Title:
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EPOXY RESIN MOLDING FOR SEALING ELECTRONIC PARTS CONTAINING ORGANIC POLYMER-GRAFTED SILICONE
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Assignees
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| 1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
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| HANNS-SCIEDEL-PLATZ 4, |
| 81737 MUNCHEN, GERMANY |
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Correspondence name and address
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DAVID T. TERRY
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ANTONELLI, TERRY, STOUT & KRAUS
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1300 NORTH SEVENTEENTH STREET
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SUITE 1800
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ARLINGTON, VA 22209
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