Patent Assignment Details
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| Reel/Frame: | 007720/0227 | |
| Pages: | 4 |
| | Recorded: | 10/06/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/1998
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Application #:
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08539855
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Filing Dt:
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10/06/1995
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Title:
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INTEGRATED CHIP MULTILAYER DECOUPLING CAPACITORS
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Assignee
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| P.O. BOX 6 |
| 8000 SO. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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BRADLEY A. FORREST
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SCHWEGMAN, LUNGBERG & WOESSNER, P.A.
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P.O. BOX 2938
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MINNEAPOLIS, MN 55402
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