Patent Assignment Details
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| Reel/Frame: | 007762/0657 | |
| Pages: | 3 |
| | Recorded: | 01/16/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/03/1997
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Application #:
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08370597
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Filing Dt:
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01/10/1995
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Title:
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TRANSFER MOLDING PROCESS FOR ENCAPSULATING SEMICONDUCTOR DEVICES
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Assignee
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| INDEPENDENCE MALL WEST, 2ND FLOOR |
| PHILADELPHIA, PENNSYLVANIA 19105 |
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Correspondence name and address
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AMOCO CORPORATION/MARY JO KANADY
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LAW DEPARTMENT - MAIL CODE 1907A
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200 EAST RANDOLPH DRIVE
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P.O. BOX 87703
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CHICAGO, ILLINOIS 60680-0703
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