Patent Assignment Details
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| Reel/Frame: | 007796/0455 | |
| Pages: | 4 |
| | Recorded: | 11/30/1995 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/02/1999
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Application #:
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08565269
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Filing Dt:
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11/30/1995
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Title:
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HIGH DENSITY INTERCONNECTED CIRCUIT MODULE WITH A COMPLIANT LAYER AS PART OF A STRESS-REDUCING MOLDED SUBSTRATE
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Assignee
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| 6801 ROCKLEDGE DRIVE |
| BETHESDA, MARYLAND 20817 |
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Correspondence name and address
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LOCKHEED MARTIN CORPORATION
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GEOFFREY H. KRAUSS
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BLDG. 8, ROOM 10B50
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P.O. BOX 8555
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PHILADELPHIA, PA 19101
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