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Patent Assignment Details
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Reel/Frame:007843/0850   Pages: 3
Recorded: 02/15/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/07/1998
Application #:
08549163
Filing Dt:
10/27/1995
Title:
A HEAT TREATMENT PROCESS FOR PREVENTING SLIPS IN SEMICONDUCTOR WAFERS
Assignors
1
Exec Dt:
02/06/1996
2
Exec Dt:
02/06/1996
3
Exec Dt:
02/06/1996
4
Exec Dt:
02/06/1996
Assignee
1
3-6, AKASAKA 5-CHOME
MINATO-KU, TOKYO-TO, JAPAN
Correspondence name and address
BEVERIDGE, DEGRANDI, WEILACHER & YOUNG
MICHAEL A. MAKUCH
1850 M STREET, N.W.
SUITE 800
WASHINGTON, D.C. 20036

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