Patent Assignment Details
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Reel/Frame: | 007875/0892 | |
| Pages: | 2 |
| | Recorded: | 02/26/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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08606798
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Filing Dt:
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02/26/1996
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Title:
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LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND THICK-FILM PASTE FOR USE IN FABRICATION THEREOF
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Assignee
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2701-1, AZA-IWAKURA, HIGASHIBUN, OMINE-CHO, YAMAGUCHI |
MINE-SHI, JAPAN 759-2 |
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Correspondence name and address
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FOLEY & LARDNER
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RICHARD L. SCHWAAB
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3000 K STREET, N.W., SUITE 500
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WASHINGTON, DC 20007-5109
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