Patent Assignment Details
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| Reel/Frame: | 007895/0552 | |
| Pages: | 2 |
| | Recorded: | 02/20/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/16/1998
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Application #:
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08604072
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Filing Dt:
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02/20/1996
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Title:
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METHOD FOR FORMING A GOLD PLATING ELECTRODE, A SUBSTRATE BASED ON THE ELECTRODE FORMING METHOD, AND A WIRE BONDING METHOD UTILIZING THIS ELECTRODE FORMING METHOD
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Assignee
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA, JAPAN |
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Correspondence name and address
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POLLOCK, VANDE SANDE & PRIDDY
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MORRIS LISS
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SUITE 800
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1990 M STREET, N.W.
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WASHINGTON, D.C. 20036
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