Patent Assignment Details
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| Reel/Frame: | 007907/0640 | |
| Pages: | 6 |
| | Recorded: | 04/26/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/13/1998
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Application #:
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08593891
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Filing Dt:
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01/30/1996
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Title:
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ADHESIVE FOR SEMICONDUCTOR DEVICE AND REINFORCING MATERIAL USING THE SAME
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Assignee
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| 5-15, KYOBASHI 1-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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WENDEROTH, LIND & PONACK
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JOHN T. MILLER, ESQ.
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805 15TH STREET, N.W., SUITE 700
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WASHINGTON, D.C. 20005
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