Patent Assignment Details
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| Reel/Frame: | 007935/0548 | |
| Pages: | 3 |
| | Recorded: | 05/13/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/01/1997
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Application #:
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08600461
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Filing Dt:
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02/13/1996
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Title:
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ENDPOINT REGULATOR AND METHOD FOR REGULATING A CHANGE IN WAFER THICKNESS IN CHEMICAL-MECHANICAL PLANARIZATION OF SEMICONDUCTOR WAFERS
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Assignee
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| P.O. BOX 6 |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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SEED AND BERRY LLP
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PAUL T. PARKER
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6300 COLUMBIA CENTER
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701 FIFTH AVENUE
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SEATTLE, WA 98104-7092
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