Patent Assignment Details
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Reel/Frame: | 007941/0092 | |
| Pages: | 2 |
| | Recorded: | 04/04/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/1999
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Application #:
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08582744
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Filing Dt:
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01/04/1996
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Title:
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LOW COST AND HIGHLY RELIABLE CHIP-SIZED PACKAGE
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Assignee
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11 SCIENCE PARK ROAD, SCIENCE PARK II |
SIGNAPORE, SINGAPORE 11768 |
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Correspondence name and address
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MELTZER, LIPPE, GOLDSTEIN,
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WOLF AND SCHLISSEL, P.C.
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ANTHONY C. COLES
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190 WILLIS AVENUE
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MINEOLA, NEW YORK 11501
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