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Patent Assignment Details
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Reel/Frame:007952/0131   Pages: 2
Recorded: 04/03/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/02/1999
Application #:
08627012
Filing Dt:
04/03/1996
Title:
METHOD OF POLISHING A CHAMFERED PORTION OF A SEMICONDUCTOR SILICON SUBSTRATE
Assignors
1
Exec Dt:
03/27/1996
2
Exec Dt:
03/27/1996
3
Exec Dt:
03/27/1996
Assignee
1
2612, SHINOMIYA, KANAGAWA
HIRATSUKA-SHI, JAPAN
Correspondence name and address
R. EUGENE VARDNELL, JR.
VARNDELL LEGAL GROUP
1150 SOUTH WASHINGTON STREET
STE. 220
ALEXANDRIA, VA 22314

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