Patent Assignment Details
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| Reel/Frame: | 007965/0752 | |
| Pages: | 3 |
| | Recorded: | 04/19/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/14/1998
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Application #:
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08635111
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Filing Dt:
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04/19/1996
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Title:
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METHOD FOR FORMING A SOLDER BUMP
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Assignee
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| 1303 E. ALGONQUIN ROAD |
| CORPORATE OFFICES/INTELLECTUAL PROPERTY DEAPRTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC./ATTN: HEATHER CREPS
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CORPORATE OFFICES
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INTELLECTUAL PROPERTY DEPARTMENT
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1303 E. ALGONQUIN ROAD
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SCHAUMBURG, IL 60196
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