Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 008039/0985 | |
| Pages: | 3 |
| | Recorded: | 07/18/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/1996
|
Application #:
|
08489983
|
Filing Dt:
|
06/12/1995
|
|
Title:
|
MODULATOR-BASED PHOTONIC CHIP-TO-CHIP INTERCONNECTIONS FOR DENSE THREE-DIMENSIONAL MULTICHIP MODULE INTEGRATION
|
|
|
Assignee
|
|
|
|
|
| UNIVERSITY PARK |
| 3716 SOUTH HOPE STREET SUITE 313 |
| LOSA ANGELES, CALIFORNIA 90007 |
|
|
Correspondence name and address
|
| |
BENMAN COLLINS & SAWYER
|
| |
DAVID W. COLLINS
|
| |
711 WEST LOS ALTOS ROAD
|
| |
TUCSON AZ 85704
|
Search Results as of:
04/29/2024 01:00 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
| 
