Patent Assignment Details
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| Reel/Frame: | 008065/0249 | |
| Pages: | 2 |
| | Recorded: | 05/15/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2000
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Application #:
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08646374
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Filing Dt:
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05/15/1996
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Title:
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MOLD RELEASING AGENT, CURED FILM OBTAINED THEREFROM AND MOLDING METHOD USING SAID MOLD RELEASING AGENT
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Assignee
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| 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU, OSAKA-SHI |
| UMEDA CENTER BUILDING |
| OSAKA, JAPAN 530 |
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Correspondence name and address
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VARNDELL LEGAL GROUP
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R. EUGENE VARNDELL, JR.
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1150 SOUTH WASHINGTON STREET
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SUITE 220
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ALEXANDRIA, VA 22314
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