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Patent Assignment Details
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Reel/Frame:008128/0844   Pages: 3
Recorded: 07/30/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/24/1998
Application #:
08688458
Filing Dt:
07/30/1996
Title:
INTEGRATED CIRCUIT CHIP HAVING ISOLATION TRENCHES COMPOSED OF A DIELECTRIC LAYER WITH OXIDATION CATALYST MATERIAL
Assignor
1
Exec Dt:
07/26/1996
Assignee
1
10950 NORTH TANTAU AVENUE
CUPERTINO, CALIFORNIA 95014
Correspondence name and address
SIEMENS CORPORATION
ELSA KELLER
INTELLECTUAL PROPERTY DEPT.
186 WOOD AVENUE, SOUTH
ISELIN, NJ 08830

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