Patent Assignment Details
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Reel/Frame: | 008139/0637 | |
| Pages: | 2 |
| | Recorded: | 08/14/1996 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/1998
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Application #:
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08696661
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Filing Dt:
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08/14/1996
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Title:
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INSULATING RESIN COMPOSITION FOR BUILD-UP BY COPPER FOIL LAMINATION AND METHOD FOR PRODUCTION OF MULTILAYER PRINTED CIRCUIT BOARD USING THE COMPOSITION
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Assignee
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7-1, HAZAWA 2-CHOME, NERIMA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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RONALD P. KANANEN, ESQ.
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MARKS & MURASE L.L.P.
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2001 L STREET N.W.
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WASHINGTON, DC 20036
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