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Patent Assignment Details
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Reel/Frame:008153/0014   Pages: 14
Recorded: 09/25/1996
Conveyance: ASSIGNEE CHANGE OF ADDRESS
Total properties: 3
1
Patent #:
Issue Dt:
09/19/1995
Application #:
08025050
Filing Dt:
03/01/1993
Title:
MULTI-CHIP MODULE INTEGRATED CIRCUIT
2
Patent #:
Issue Dt:
07/25/1995
Application #:
08073810
Filing Dt:
06/07/1993
Title:
SIMULATION USING COMPILED FUNCTION DESCRIPTION LANGUAGE
3
Patent #:
Issue Dt:
07/30/1996
Application #:
08121102
Filing Dt:
09/14/1993
Title:
TESTING INTEGRATED CIRCUITS BY CONSOLIDATING A PLURALITY OF DIGITAL SIGNALS AS A MULTILEVEL SIGNAL
Assignor
1
Exec Dt:
01/05/1996
Assignee
1
CENTRAL SHIN OSAKA BLDG.
4-5-36, MIYAHARA, YODOGAWA-KU
OSAKA-SHI 532, JAPAN
Correspondence name and address
FRISHAUF HOLTZ GOODMAN LANGER & CHICK PC
THOMAS LANGER
767 THIRD AVENUE
25TH FLOOR
NEW YORK, NY 10017-2023

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