Patent Assignment Details
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| Reel/Frame: | 008155/0304 | |
| Pages: | 4 |
| | Recorded: | 08/21/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/03/1998
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Application #:
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08701029
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Filing Dt:
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08/21/1996
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Title:
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ELECTRONIC COMPONENT PACKAGE WITH DECOUPLING CAPACITORS COMPLETELY WITHIN DIE RECEIVING CAVITY OF SUBSTRATE
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Assignee
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| OLD ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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IBM CORPORATION
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AZIZ M. AHEAN
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DEPT. 18G/BLDG. 300-482
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1580 ROUTE 52
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HOPEWELL JUNCTION, NY 12533-6531
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