Patent Assignment Details
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| Reel/Frame: | 008160/0994 | |
| Pages: | 4 |
| | Recorded: | 06/26/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/18/2001
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Application #:
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08673623
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Filing Dt:
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06/26/1996
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Title:
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METHOD OF VLSI CONTACT, TRENCH, AND VIA FILLING USING A GERMANIUM UNDERLAYER WITH LOW TEMPERATURE METALLIZATION
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Assignee
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| 8000 SOUTH FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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BRADLEY K. DESANDRO
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60 EAST SOUTH TEMPLE
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1000 EAGLE GATE TOWER
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SALT LAKE CITY, UT 84111
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