Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 008162/0321 | |
| Pages: | 15 |
| | Recorded: | 06/17/1996 | | |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/1988
|
Application #:
|
06940328
|
Filing Dt:
|
12/11/1986
|
|
Title:
|
CONTROL APPARATUS FOR REDUCING ADHESIVE FORCE OF ADHESIVE AGENT ADHERING BETWEEN SEMICONDUCTOR WAFER AND SUBSTRATE
|
|
|
Assignee
|
|
|
|
|
| NO. 23-23 HON-CHO, ITABASHI-KU |
| TOKYO, JAPAN |
|
|
Correspondence name and address
|
| |
ARMSTRONG, WESTERMAN, HATTORI, ET AL.
|
| |
LE-NHUNG MCLELAND
|
| |
SUITE 1000
|
| |
1725 K STREET, N.W.
|
| |
WASHINGTON, D.C. 20006
|
Search Results as of:
05/17/2024 03:44 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
