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Patent Assignment Details
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Reel/Frame:008219/0804   Pages: 4
Recorded: 09/03/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/03/1998
Application #:
08706863
Filing Dt:
09/03/1996
Title:
METHOD FOR FORMING SOLDER BUMPS ON BOND PADS
Assignors
1
Exec Dt:
08/14/1996
2
Exec Dt:
08/02/1996
Assignee
1
1303 E. ALGONQUIN ROAD
CORPORATE OFFICES INTELLECTUAL PROPERTY DEPARTMENT
SCHAUMBURG, ILLINOIS 60196
Correspondence name and address
MOTOROLA, INC., CORPORATE OFFICES
DOUGLAS D. FEKETE
INTELLECTUAL PROPERTY DEPARTMENT
1303 E. ALGONQUIN ROAD
SCHAUMBURG, IL 60196

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