Patent Assignment Details
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| Reel/Frame: | 008229/0710 | |
| Pages: | 3 |
| | Recorded: | 10/29/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/23/1997
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Application #:
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08688173
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Filing Dt:
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07/29/1996
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS AND PROCESS OF AND APPARATUS FOR GRINDING USED FOR THE SAME METHOD OF MANUFACTURE
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Assignee
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| TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, TOKYO, 100, JAPAN |
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Correspondence name and address
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EVENSON, MCKEOWN, EDWARDS & LENAHAN
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J. D. EVANS
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1200 G STREET, N.W.
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SUITE 700
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WASHINGTON, DC 20005
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