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Patent Assignment Details
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Reel/Frame:008384/0306   Pages: 2
Recorded: 12/20/1996
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/26/1999
Application #:
08771636
Filing Dt:
12/20/1996
Title:
APPARATUS AND METHOD FOR STACKABLE MOLDED LEAD FRAME BALL GRID ARRAY PACKAGING OF INTEGRATED CIRCUITS
Assignors
1
Exec Dt:
12/19/1996
2
Exec Dt:
12/19/1996
3
Exec Dt:
12/19/1996
Assignee
1
1551 MCCARTHY BOULEVARD
MILPITAS, CALIFORNIA 95035
Correspondence name and address
FENWICK & WEST LLP
ALBERT C. SMITH, ESQ.
TWO PALO ALTO SQUARE, SUITE 700
PALO ALTO, CALIFORNIA 94306

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