Patent Assignment Details
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| Reel/Frame: | 008395/0811 | |
| Pages: | 2 |
| | Recorded: | 02/19/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/1999
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Application #:
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08782394
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Filing Dt:
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01/13/1997
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Title:
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SEMICONDUCTOR DEVICE COMPRISING BONDING PAD OF BARRIER METAL, SILICIDE AND ALUMINUM
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Assignee
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| 6-21, KYOBASHI 2-CHOME, CHUO-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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JORDAN & HAMBURG
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FRANK J. JORDAN, ESQ.
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CHANIN BUILDING
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122 EAST 42ND STREET, SUITE 3303
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NEW YORK, NY 10168
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