Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 008532/0295 | |
| Pages: | 2 |
| | Recorded: | 08/01/1996 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/24/1998
|
Application #:
|
08601046
|
Filing Dt:
|
02/23/1996
|
|
Title:
|
HIGH DENSITY MULTI-LAYERED PRINTED WIRING BOARD, MULTI-CHIP CARRIER AND SEMICONDUCTOR PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 1, KANDA-MACHI 2-CHOME, OGAKI-SHI |
| GIFU-KEN 503, JAPAN |
|
|
Correspondence name and address
|
| |
HICKMAN BEYER & WEAVER
|
| |
STEVE D. BEYER
|
| |
P.O. BOX 61059
|
| |
PALO ALTO, CA 94306
|
Search Results as of:
05/05/2024 01:15 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
