Patent Assignment Details
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| Reel/Frame: | 008567/0529 | |
| Pages: | 2 |
| | Recorded: | 06/16/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/22/1998
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Application #:
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08807081
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Filing Dt:
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02/27/1997
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Title:
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THERMOCOMPRESSING BONDING METHOD AND THERMOCOMPRESSING BONDING APPARATUS
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Assignee
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| 72, HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, MAIER
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& NEUSTADT, P.C., ATTORNEYS AT LAW
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MARVIN J. SPIVAK, FOURTH FLOOR
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1755 JEFFERSON DAVIS HIGHWAY
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ARLINGTON, VIRGINIA 22202
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