Patent Assignment Details
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Reel/Frame: | 008575/0405 | |
| Pages: | 2 |
| | Recorded: | 05/19/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/1998
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Application #:
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08858846
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Filing Dt:
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05/19/1997
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Title:
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SEMICONDUCTOR PACKAGE AND DEVICE HAVING LEADS COUPLED WITH INSULATING MATERIAL
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Assignee
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711, AZA SHARIDEN, OAZA KURITA, NAGOANO-SHI |
NAGANO, JAPAN |
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Correspondence name and address
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PENNIE & EDMONDS LLP
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1155 AVENUE OF THE AMERICAS
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NEW YORK, NY 10036
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