Patent Assignment Details
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| Reel/Frame: | 008606/0842 | |
| Pages: | 3 |
| | Recorded: | 06/06/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/30/1999
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Application #:
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08870906
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Filing Dt:
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06/06/1997
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Title:
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LEADFRAME FOR INTEGRATED CIRCUIT PACKAGE
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Assignee
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| HSINCHU INDUSTRIAL PARK |
| NO. 6, SHIH CHIEN ROAD, HU KOU |
| HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW ET AL.
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MR, ERNEST F. CHAPMAN
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1300 I. STREET, N.W.
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WASHINGTON, D.C. 20005
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