Patent Assignment Details
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Reel/Frame: | 008608/0027 | |
| Pages: | 3 |
| | Recorded: | 06/19/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/24/1999
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Application #:
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08878789
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Filing Dt:
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06/19/1997
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Title:
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COMPOSITE MOLDING COMPRISING SILICONE GEL MOLDING AND PEELABLE FILM, AND METHOD FOR MANUFACTURING SAME
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Assignee
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4TH FL., AIG BLDG. 1-1-3, MARUNOUCHI, CHIYODA-KU |
TOKYO 100, JAPAN |
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Correspondence name and address
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DOW CORNING CORPORATION
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PAULA J. LAGUTTUTA
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PATENT DEPARTMENT MAIL CO1232
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P.O. BOX 0994
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MIDLAND, MI 48686
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