Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 008628/0291 | |
| Pages: | 4 |
| | Recorded: | 08/01/1997 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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08/06/1996
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Application #:
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08448855
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Filing Dt:
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05/24/1995
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Title:
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SEMICONDUCTOR CERAMIC PACKAGE WITH THERMAL VIAS
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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08606798
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Filing Dt:
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02/26/1996
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Title:
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LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND THICK-FILM PASTE FOR USE IN FABRICATION THEREOF
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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08816032
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Filing Dt:
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03/11/1997
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Title:
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LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND THICK-FILM PASTE FOR USE IN FABRICATION THEREOF
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Assignee
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| OHMINE-CHO, MINE-SHI |
| 2701-1, AZA IWAKURA, HIGASHIBUN |
| YAMAGUCHI-PERFECTURE, JAPAN |
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Correspondence name and address
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RICHARD L. SCHWAAB
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PATENT DEPARTMENT
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3000 K STREET, SUITE 500
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WASHINGTON, D.C. 20007-5109
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