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Patent Assignment Details
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Reel/Frame:008640/0330   Pages: 3
Recorded: 06/18/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/14/2002
Application #:
08878143
Filing Dt:
06/18/1997
Publication #:
Pub Dt:
10/25/2001
Title:
COPPER ALLOY SEED LAYER FOR COPPER METALLIZATION
Assignors
1
Exec Dt:
05/28/1997
2
Exec Dt:
05/28/1997
3
Exec Dt:
05/28/1997
4
Exec Dt:
05/28/1997
5
Exec Dt:
05/30/1997
Assignee
1
2880 SCOTT BLVD. PO BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondence name and address
APPLIED MATERIALS, INC.
CHARLELS S. GUENZER
2880 SCOTT BLVD.
P.O. BOX 450A
SANTA CLARA, CA 95052

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