Patent Assignment Details
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| Reel/Frame: | 008653/0349 | |
| Pages: | 2 |
| | Recorded: | 07/28/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/1999
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Application #:
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08901209
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Filing Dt:
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07/28/1997
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Title:
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AUTOMATIC WAFER PLATING EQUIPMENT
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Assignee
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| 6-6 NIHOMBASHI-KAYABACHO 2-CHOME, CHUO-KU |
| FL. 18, NO. 106, SEC. 2 |
| TOKYO, JAPAN |
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Correspondence name and address
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KILPATRICK STOCKTON LLP
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MICHAEL D. BEDNAREK, ESQ.
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700 13TH STREET, N.W. SUITE 800
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WASHINGTON, D.C. 20005
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