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Patent Assignment Details
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Reel/Frame:008659/0001   Pages: 2
Recorded: 07/22/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/13/1998
Application #:
08790577
Filing Dt:
01/29/1997
Title:
LID WITH VARIABLE SOLDER LAYER FOR SEALING SEMICONDUCTOR PACKAGE, PACKAGE HAVING THE LID AND METHOD FOR PRODUCING THE LID
Assignors
1
Exec Dt:
11/25/1996
2
Exec Dt:
11/25/1996
3
Exec Dt:
11/25/1996
4
Exec Dt:
11/24/1996
5
Exec Dt:
11/25/1996
Assignees
1
OHMINE-CHO, MINE-SHI
2701-1, AZA-IWAKURA, HIGASHIBUN
YAMAGUCHI, JAPAN
2
OHMINE-CHO, MINE-SHI
2150 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondence name and address
FLYNN, THIEL, BOUTELL, ET AL.
TERRYENCE F. CHAPMAN
2026 RAMBLING ROAD
KALAMAZOO, MI 49008-1699

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