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Reel/Frame:008701/0579   Pages: 3
Recorded: 08/27/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/24/1999
Application #:
08920133
Filing Dt:
08/27/1997
Title:
METHOD OF FABRICATING A PASSIVATION LAYER FOR INTERGRATED CIRCUITS
Assignors
1
Exec Dt:
08/07/1997
2
Exec Dt:
08/08/1997
3
Exec Dt:
08/11/1997
4
Exec Dt:
08/11/1997
5
Exec Dt:
08/12/1997
Assignee
1
SCIENCE-BASED INDUSTRIAL PARK
123, PARK AVE-3RD
HSINCHU, TAIWAN R.O.C
Correspondence name and address
CHRISTENSEN O'CONNOR JOHNSON & KINDNESS
JAMES W. SOONG, ESQ.
1420 FIFTH AVENUE
SUITE 2800
SEATTLE, WA 98101-2347

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