Patent Assignment Details
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| Reel/Frame: | 008739/0472 | |
| Pages: | 2 |
| | Recorded: | 09/05/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08864365
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Filing Dt:
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05/28/1997
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Title:
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METHOD FOR DEPOSITING A FLOW FILL LAYER ON AN INTEGRATED CIRCUIT WAFER
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Assignee
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| P.O. BOX 619 |
| 10556 MIGDAL HAEMEK, ISRAEL |
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Correspondence name and address
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C/O ROBERT SHEINBEIN
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MARK M. FRIEDMAN
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2940 BIRCHTREE LANE
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SILVER SPRING, MD 20906
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