Patent Assignment Details
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| Reel/Frame: | 008743/0291 | |
| Pages: | 3 |
| | Recorded: | 10/02/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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08872950
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Filing Dt:
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06/11/1997
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Title:
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RADIO FREQUENCY MODULE WITH THERMALLY AND ELECTRICALLY COUPLED METAL FILM ON INSULATING SUBSTRATE
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Assignee
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| KADOMA-SHI |
| 1006, OAZA KADOMA |
| OSAKA, JAPAN 571 |
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Correspondence name and address
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RENNER, OTTO, BOISSELLE ET AL.
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NEIL A. DUCHEZ
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1621 EUCLID AVENUE
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NINETEENTH FLOOR
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CLEVELAND, OH 44115-2191
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