Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 008744/0419 | |
| Pages: | 4 |
| | Recorded: | 10/09/1997 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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05/06/1997
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Application #:
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08362129
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Filing Dt:
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12/22/1994
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Title:
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MULTILAYER CERAMIC CIRCUIT SUBSTRATE, PROCESS FOR PRODUCING THE SAME, AND ELECTRICALLY CONDUCTIVE MATERIAL FOR USE IN MULTILAYER CERAMIC CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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03/24/1998
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Application #:
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08561539
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Filing Dt:
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11/22/1995
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Title:
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A PROCESS FOR PRODUCING A MULTILAYER CERAMIC CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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03/03/1998
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Application #:
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08590518
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Filing Dt:
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03/06/1996
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Title:
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CONDUCTIVE PASTE CONTAINING Z-TETRADECANOL AND CERAMIC CIRCUIT SUB- STRATE USING THE SAME
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Assignee
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| 2701-1, AZA-IWAKURA, HIGASHIBUN, OHMINE-CHO |
| MINE-SHI, YAMAGUCHI, JAPAN |
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Correspondence name and address
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FLYNN, THIEL, BOUTELL & TANIS P.C.
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DALE H. THIEL
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2026 RAMBLING ROAD
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KALAMAZOO, MI 49008-1699
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