Patent Assignment Details
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| Reel/Frame: | 008747/0242 | |
| Pages: | 5 |
| | Recorded: | 04/23/1997 | | |
| Conveyance: | CORRECTED ASSIGNMENT TO CORRECT SERIAL NUMBER, PREVIOUSLY RECORDED ON REEL 7561 FRAME 0897. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/15/1999
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Application #:
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08842302
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Filing Dt:
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04/23/1997
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Title:
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METHOD TO THERMALLY FORM HEMISPHERICAL GRAIN (HSG) SILICON TO ENHANCE CAPACITANCE FOR APPLICATION IN HIGH DENSITY DRAMS
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Assignee
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| PATENT DEPT. MS #525 |
| 8000 S. FEDERAL WAY |
| BOISE, IDAHO 83707 |
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Correspondence name and address
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MICRON TECHNOLOGY, INC.
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DAVID J. PAUL
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PATENT DEPT. MS #525
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8000 S. FEDERAL WAY
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BOISE, ID 83707
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