Patent Assignment Details
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| Reel/Frame: | 008755/0214 | |
| Pages: | 2 |
| | Recorded: | 09/30/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08941294
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Filing Dt:
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09/30/1997
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER
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Assignee
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| 2612, SHINOMIYA, HIRATSUKA-SHI |
| KANAGAWA 254, JAPAN |
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Correspondence name and address
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SUGHRUE, MION, ZINN, MACPEAK & SEAS
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DARRYL MEXIC
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2100 PENNSYLVANIA AVENUE, N.W.
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SUITE 800
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WASHINGTON, D.C 20037-3202
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