Patent Assignment Details
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| Reel/Frame: | 008788/0493 | |
| Pages: | 13 |
| | Recorded: | 11/04/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/20/1999
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Application #:
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08657216
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Filing Dt:
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06/03/1996
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Title:
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MICROELECTRONIC ASSEMBLY INCLUDING POLYMERIC REINFORCEMENT ON AN INTEGRATED CIRCUIT DIE, AND METHOD FOR FORMING SAME
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Assignee
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| CORPORATE OFFICES INTELLECTUAL PROPERTY DEPT. |
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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Correspondence name and address
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MOTOROLA, INC.
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CORPORATE OFFICES
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INTELLECTUAL PROPERTY DEPARTMENT
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1303 E. ALGONQUIN ROAD
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SCHAUMBURG, IL 60196
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