Patent Assignment Details
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Reel/Frame: | 008841/0669 | |
| Pages: | 9 |
| | Recorded: | 10/30/1997 | | |
Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/25/1997
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Application #:
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08060902
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Filing Dt:
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05/13/1993
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Title:
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IN SITU ETCH PROCESS FOR INSULATING AND CONDUCTIVE MATERIALS
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Assignee
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8000 S. FEDERAL WAY |
BOISE, IDAHO 83706 |
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Correspondence name and address
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MICRON TECHNOLOGY, INC.
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WALTER D. FIELDS
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8000 S. FEDERAL WAY
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BOISE, IDAHO 83706-9632
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