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Patent Assignment Details
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Reel/Frame:008880/0034   Pages: 2
Recorded: 11/19/1997
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/08/1998
Application #:
08840639
Filing Dt:
04/25/1997
Title:
PROCESS AND APPARATUS FOR FABRICATING A SEMICONDUCTOR WAFER
Assignor
1
Exec Dt:
06/03/1997
Assignee
1
2612, SHINOMIYA, HIRATSUKA-SHI
KANAGAWA 254, JAPAN
Correspondence name and address
SUGHRUE, MION, ZINN MACPEAK & SEAS
DARRYL MEXIC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037-3202

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